Awarded
Lote 3: Equipo de soldadura de chip de cara a baile (Flip-Chip Bonder) de hasta 10 μm de precisión.
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- Winners
- Electron mec srl
- Contract value
- €111,880
- Bids received
- 1
- Published
- 1 Jul 2025
- Awarded
- 1 Jul 2025
- Contract start
- 1 Jul 2025
- Contract end
- 22 Feb 2026estimated
- Sector
- Electrical machinery
- Region
- Barcelona