Awarded

TCWM - Thermocompression Wafer Molding

Name: TCWM - Thermocompression Wafer Molding
Creator: Silicon Austria Labs GmbH
Published: 2025-03-18
License: https://ted.europa.eu/en/simap/legal-notice

Track this recordFree account — get alerted when a contract here runs out.

Buyer: Silicon Austria Labs GmbH
Winners: APIC YAMADA CORPORATION
Contract value: €750,150
Published: 18 Mar 2025
Awarded: 18 Feb 2025
Contract start: 18 Feb 2025
Contract end: 19 Jun 2025estimated
Sector: Laboratory and optical equipment
Region: Klagenfurt-Villach
Source: Original notice on TED (182389-2025)

More awards from this buyer

Awarded	Buyer	Winner	Contract value	Published
Silicon Austria Labs – Rapid thermal processing	Silicon Austria Labs GmbH	JTEKT THERMO SYSTEMS CORPORATION	€1,058,252	8 Sept 2026
Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace]	Silicon Austria Labs GmbH	Futek Furnace Inc.	€1,460,000	26 Aug 2026
Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment	Silicon Austria Labs GmbH	Canon Europa N.V.	€9,352,951	24 Aug 2026
Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool	Silicon Austria Labs GmbH	scia Systems	€1,239,173	11 Aug 2026
Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements	Silicon Austria Labs GmbH	Onto Innovation	€1,031,194	11 Aug 2026
Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging	Silicon Austria Labs GmbH	Schmoll Maschinen GmbH	€469,747	5 Aug 2026