Awarded

TCWM - Thermocompression Wafer Molding

Name: TCWM - Thermocompression Wafer Molding
Creator: Silicon Austria Labs GmbH
Published: 2025-03-18
License: https://ted.europa.eu/en/simap/legal-notice

Original language: German

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Buyer: Silicon Austria Labs GmbH
Winners: APIC YAMADA CORPORATION
Contract value: €750,150
Published: 18 Mar 2025
Awarded: 18 Feb 2025
Contract start: 18 Feb 2025
Contract end: 19 Jun 2025estimated
Sector: Laboratory and optical equipment
Region: Klagenfurt-Villach
Source: Original notice on TED (182389-2025)

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