Awarded

Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)

Name: Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)
Creator: Silicon Austria Labs GmbH
Published: 2026-01-15
License: https://ted.europa.eu/en/simap/legal-notice

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Buyer: Silicon Austria Labs GmbH
Winners: Evatec Europe GmbH
Contract value: €1,000,000
Bids received: 1
Published: 15 Jan 2026
Awarded: 19 Dec 2025
Contract start: 19 Dec 2025
Contract end: 19 Apr 2026estimated
Sector: Laboratory and optical equipment
Region: Graz
Source: Original notice on TED (31435-2026)

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