Awarded
Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
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- Winners
- Schmoll Maschinen GmbH
- Contract value
- €469,747
- Bids received
- 2
- Published
- 5 Aug 2026
- Awarded
- 6 Jul 2026
- Contract start
- 6 Jul 2026
- Contract end
- 4 Nov 2026estimated
- Region
- Klagenfurt-Villach
More awards from this buyer
| Awarded | Buyer | Winner | Contract value | Published |
|---|---|---|---|---|
| Silicon Austria Labs – Rapid thermal processing | Silicon Austria Labs GmbH | JTEKT THERMO SYSTEMS CORPORATION | €1,058,252 | 8 Sept 2026 |
| Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace] | Silicon Austria Labs GmbH | Futek Furnace Inc. | €1,460,000 | 26 Aug 2026 |
| Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment | Silicon Austria Labs GmbH | Canon Europa N.V. | €9,352,951 | 24 Aug 2026 |
| Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool | Silicon Austria Labs GmbH | scia Systems | €1,239,173 | 11 Aug 2026 |
| Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements | Silicon Austria Labs GmbH | Onto Innovation | €1,031,194 | 11 Aug 2026 |
| Hybrid Wafer Bonding | Silicon Austria Labs GmbH | EV Group Europe & Asia/Pacific GmbH | €2,797,834 | 5 Aug 2026 |