Awarded

Lote 2. Sistema de impresión 2D de ultra alta resolución. WIRE BONDER automático. DIE BONDER. WIRE BONDER.

Original language: Spanish

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Contract value
€341,160
Bids received
1
Published
9 Sept 2026
Awarded
1 Sept 2026
Contract start
1 Sept 2026
Contract end
20 May 2027estimated

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