Awarded

Flip Chip Die Bonder

Name: Flip Chip Die Bonder
Creator: FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Published: 2026-09-28
License: https://ted.europa.eu/en/simap/legal-notice

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Buyer: FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Winners: Finetech GmbH & Co. KG
Contract value: €234,757
Bids received: 1
Published: 28 Sept 2026
Awarded: 28 Sept 2026
Contract start: 28 Sept 2026
Contract end: 27 Jan 2027estimated
Sector: Laboratory and optical equipment
Region: Darmstadt, Kreisfreie Stadt
Source: Original notice on TED (667627-2026)

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48Ca	FAIR - Facility for Antiproton and Ion Research in Europe GmbH	TRACE Sciences International Corporation	€232,919	28 Sept 2026
Installation PAS (Personnel Access System)	FAIR - Facility for Antiproton and Ion Research in Europe GmbH	Energie Gate Solutions GmbH	—	22 Sept 2026
RV für die Erbringung von vergabe-, vertrags- (bau- und architektenrechtlichen) und verwaltungsrechtlichen Beratungsleistungen	FAIR - Facility for Antiproton and Ion Research in Europe GmbH	KNH Rechtsanwälte	—	14 Sept 2026
Rectangular blind flanges for the focal plane chambers of the SFRS	FAIR - Facility for Antiproton and Ion Research in Europe GmbH	STREICHER, spol. s r.o. Plzeň	€100,200	1 Sept 2026
RV CAFM für den Betrieb FAIR mit GSI	FAIR - Facility for Antiproton and Ion Research in Europe GmbH	pit-cup	—	24 Aug 2026
Exhaust air measurement system for FAIR	FAIR - Facility for Antiproton and Ion Research in Europe GmbH	Berthold Technologies GmbH & Co. KG	€337,510	19 Aug 2026