Awarded
Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
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- Buyer
- —
- Winners
- —
- Contract value
- no value published
- Bids received
- 3
- Published
- 14 Oct 2026
- Awarded
- 8 Oct 2026
- Contract start
- 8 Oct 2026
- Contract end
- 9 Jun 2027estimated
- Sector
- Industrial machinery