Awarded

Silicon Austria Labs – Chips JU: Wafer bumper

Name: Silicon Austria Labs – Chips JU: Wafer bumper
Creator: Silicon Austria Labs GmbH
Published: 2026-06-02
License: https://ted.europa.eu/en/simap/legal-notice

Original language: German

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Buyer: Silicon Austria Labs GmbH
Winners: Pac Tech – Packaging Technologies GmbH
Contract value: €1,260,320
Bids received: 1
Published: 2 Jun 2026
Awarded: 8 May 2026
Contract start: 8 May 2026
Contract end: 6 Sept 2026estimated
Sector: Laboratory and optical equipment
Region: Klagenfurt-Villach
Source: Original notice on TED (378296-2026)

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