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Supplier
Pac Tech – Packaging Technologies GmbH
Nauen · DEU
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Awards
2
Total awarded
€1.6m
2 / 2 with a value
Buyers
2
Sectors
1
Reg. 1
Awards
| Awarded | Buyer | Winner | Contract value | Published |
|---|---|---|---|---|
| Silicon Austria Labs – Chips JU: Wafer bumper | Silicon Austria Labs GmbH | Pac Tech – Packaging Technologies GmbH | €1,260,320 | 2 Jun 2026 |
| Dostawa urządzenia do nanoszenia kulek lutowniczych metodą solder jetting | Centrum Zaawansowanych Materiałów i Technologii CEZAMAT Politechniki Warszawskiej | Pac Tech – Packaging Technologies GmbH | €293,377 | 11 Aug 2025 |
Also filed as
Pac Tech - Packaging Technologies GmbH · Pac Tech – Packaging Technologies GmbH